Next Chapter Meeting:
5:30 - 6:00 - Social time.
Attendance is free of charge to all IEEE Members and Non-Members
Please email Jim Teune (Jim.firstname.lastname@example.org) if you plan to attend.
Signal Integrity Characterization, Parameters and Techniques
This presentation will focus on the key electrical parameters that are important to understand and measure for ensuring optimum performance in today's high speed serial communications interfaces. These include fundamental quantities such as inductance, capacitance, and propagation delay as well as "derived" quantities of impedance, insertion and return loss, skew, crosstalk, etc. Software tools for extracting these parameters will also be discussed.
Joseph C. Diepenbrock of Lorom Group
Joseph C. (Jay) Diepenbrock worked in a number of development areas in IBM including IC, analog and RF circuit, and backplane design. He then
moved to IBM"s Integrated Supply Chain, working on the electrical specification, testing, and modeling of connectors and cables and was IBM's
Subject Matter Expert on high speed cables. After over 35 years at IBM he left there and joined the Lorom Group as Senior Vice President,
High Speed and is leading the Lorom Signal Integrity team and supporting its high speed product development. Mr. Diepenbrock has authored
or co-authored a number of technical papers and contributed to a number of industry standards, is a Senior Member of the IEEE, and holds